Technical Data
| Optical applications | anti-reflective coating, optical filters, metallic mirror surfaces, beam splitters |
|---|---|
| Coating material | metals: Cr, Al, Au, Ag, In, Cu, Ti, Pt, Pa, Ni oxides/fluorides: SiO2, Al2O3, Ta2O5, TiO2, Ti2O2, Ti3O5, HfO2, Sb2O3, BaF2, MgF2 |
| Technologies | electron beam evaporators, thermal evaporators, ion-assisted deposition (IAD), plasma pre-treatment |
| Process monitoring | quartz-crystal thin-film controller, optical monitoring system OMD 8000, optionally MOCCA® |
| Substrate materials | glass, ceramics, metals, various polymers |
| Substrate geometries | wafers, curved & 3D, square & rectangular |
| Substrate holder diameter | 450 mm, 700 mm, 900 mm, 1.200 mm, 1.400 mm* *(depending on chamber size) |
| Type of substrate holder | segmented calotte, planetary system, flat palettes or trays, customized substrate holders on request |
| Temperature | RT up to 300°C |
| Capacity | depending on the geometry and size of the substrate as well as on the chamber size |
| Rotation speed of substrate holder | 1 - 12 rpm |
| Software & control | Siemens PLC SIMATIC and WINCC |
FAQ
This can be achieved by rotating the substrate holder and, in particular, by using correction masks, extending to sub-rotation of the individual substrates. The layer-thickness uniformity can be improved by positioning the sources and tilting the substrates, for example on a calotte.
The lining plates are designed for easy maintenance and replacement and are attached to the chamber walls using removable pins and spring clips.
For substrate pre-treatment and to support coating processes, glow-discharge sources, ion sources, and microwave plasma sources are used in particular to clean and activate surfaces at the atomic level or to specifically modify film growth.
The substrates can be removed and replaced individually, or by removing the entire substrate holder or one of its segments.
Polymer materials, glass, metals, and ceramics can all be coated.
