Advanced Packaging

Vacuum Deposition Equipment for Small & Large Substrates

Advanced packaging offers a variety of possibilities to efficiently connect chips of different technologies. 

Increasingly complex electronic systems are being manufactured in three-dimensional structures. The requirements for the conductive and insulating layers are becoming higher and the manufacturing sizes of the panels larger in order to be able to produce cost-effectively.

To manufacture these systems, specially adapted deposition equipment is required for the metallization. And this is exactly what we can offer you.